CHIPS and Science Act

As part of the CHIPS & Science Act, Congress created the Tech Hubs program to help more regions become leaders in key technology sectors through substantial investments into regional consortia. It authorized spending $10 billion on the program from FY2023 through FY2027. But appropriations for the program are not keeping up with the vision that was embraced by strong bipartisan majorities in both chambers. For FY2023, Congress appropriated $500 million for the program, and it followed that up with only $41 million for FY2024. The need for the program has not changed. If you believe the program should receive funding in line with the vision Congress laid out in the CHIPS & Science Act, we invite you to join us and let Congress know by signing a letter that will strongly voice support for the program. Read the full letter and sign on today.

Activity to build the U.S. semiconductor industry picked up steam on Monday, December 11. On that day, New York State, Gov. Kathy Hochul announced the state was committing $1 billion to what her office described as “a $10 billion partnership with leaders from the semiconductor industry such as IBM, Micron, Applied Materials, Tokyo Electron, and others to establish a next-generation semiconductor research and development center at NY CREATES’ Albany NanoTech Complex.” Also on that day, the U.S. Department of Commerce announced the U.S. Department of Commerce and BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., have signed a non-binding preliminary memorandum of terms (PMT) to provide approximately $35 million in federal incentives under the CHIPS and Science Act to support the modernization of the company’s Microelectronics Center in Nashua, New Hampshire.

Last week, a Senate committee heard Commerce Secretary Gina Raimondo and National Science Foundation Director Sethuraman Panchanathan discuss CHIPS & Science Act program implementation (similar to a September hearing in the House). Both agency leaders affirmed rapid progress toward making funding announcements on major programs and reminded the committee that more funding is needed to meet the vision Congress defined in its legislation.

The economies, the wellbeing, and the stories of the U.S. and China have become so intertwined and so interdependent that individuals not following global political-military-ideological studies might be excused for getting lost in the narrative, let alone following such a complex plot. There won’t be a simplifying explanation offered here, but there are a few new twists in the storyline SSTI wanted to share that may relate to the innovation investment, product development, and exit strategies for some parties within the TBED community. 

The Department of Defense announced yesterday that it issued $238 million from "Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act" funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs. With $2 billion in funding for Fiscal Years 2023 through 2027, the Microelectronics Commons program aims to leverage these hubs to accelerate domestic hardware prototyping and "lab-to-fab" transition of semiconductor technologies. The hope is this will help mitigate supply chain risks and ultimately expedite access to the most cutting-edge microchips for U.S. troops.

Commerce Secretary Gina M. Raimondo testified Tuesday to the House Committee on Science, Space, and Technology on the implementation of the CHIPS and Science Act. During the hearing, Raimondo spoke about the importance of the Regional Innovation and Technology Hubs and CHIPS manufacturing programs for national and economic security and emphasized the need for additional funding to make Congress’s vision for these programs successful. The focus of the hearing was the Department of Commerce’s implementation of incentives for semiconductor and related manufacturing, but a wide range of topics was covered. Committee members asked Secretary Raimondo to comment on skilled workforce, national security, reliance on other nations, and guardrails on funding, among other issues.

The "CHIPS and Science Act" authorizes both the National Science Foundation (NSF) and the U.S. Economic Development Administration (EDA) to implement programs to enable regional technology development and economic and job growth through NSF Regional Innovation Engines (NSF Engines) and EDA Regional Technology and Innovation Hub (Tech Hubs) programs. To officially enable cooperation between the two agencies as they pursue these similar goals, NSF and EDA signed a memorandum of understanding MOU. The MOU allows for coordinating specific projects, programs, and facilities. The coordination may include research and education activities, facilities, centers, data infrastructure and outreach.

Did you use the Recompete Mapping Tool to check your eligibility for this new EDA funding opportunity when the fact sheet and map were first released? If you did, and you got the response, “Contact your local economic development office” don’t stop there! EDA has updated its mapping tool in the past few days to reflect significant flexibility in program eligibility. These changes mean that many more regions may be able to successfully compete for strategy development awards and, ultimately, implementation awards.

The upshot of the debt ceiling deal recently approved by Congress is that all nondefense discretionary spending will remain at its current level of $638 billion in FY 2024, which begins October 1. Additionally, some funds were marked for recission, including $150 million from the State Small Business Credit Initiative (SSBCI). All jurisdictions that have been approved or have applied for SSBCI funding will not see a decrease in their funds, according to an email from Treasury regarding SSBCI. SSBCI incentive allocation funds and Formula Technical Assistance (TA) Grant Program allocations for Tribal governments, states, territories, and D.C. also will not be affected by the legislation. More complicated is the impact the deal will have on funding for research, innovation, and education.