Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging.

The National Institute of Standards of Technology (NIST) is seeking public input through Requests for Information (RFIs) for two programs under the CHIPS Act. Under Secretary of Commerce for Standards and Technology and NIST Director Laurie E.

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio announced five leaders joining the CHIPS Research and Development Office within CHIPS for America.

This week, the U.S. Department of Commerce updated its timeline for funding opportunities that support semiconductor and related manufacturing, as well as relevant R&D facilities. The department still intends, as first stated in its strategic plan last fall, to make funding for chip fabrication facilities available later this month.