CHIPS for America to invest up to $1.6 billion to accelerate U.S. capacity advanced packaging
The U.S. Department of Commerce recently issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities to accelerate domestic capacity for semiconductor advanced packaging. As part of CHIPS for America, the National Advanced Packaging Manufacturing Program plans to invest up to $1.6 billion to fund innovation in five R&D areas related to semiconductor advanced packaging.