advanced manufacturing

NIST reveals plan for boosting U.S. advanced packaging capabilities for semiconductors

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging. Advanced packaging is a cutting-edge design and manufacturing method that places multiple chips with a variety of functions in a densely interconnected two- or three-dimensional “package.” This design paradigm, according to a press release from NIST,  “can help the sector achieve the ever denser, smaller dimensions that the most advanced semiconductors require.” But NIST also notes that “currently, the United States is limited in both conventional and advanced packaging capacity.” 

Recent research: Urban and rural manufacturers talent strategies diverge, lessons for community colleges, manufacturers and others

The challenge of attracting and retaining skilled manufacturing talent consistently ranks as a top concern in the industry. Recent findings from the National Association of Manufacturers (NAM) show that more than 70% of industry leaders cite workforce issues as their primary challenge for the past year, outpacing supply chain disruptions and rising raw material costs. To better understand this challenge, the Manufacturing Institute has released a new report exploring how location influences manufacturing companies’ talent development efforts. The study surveyed over 100 manufacturing firms, asking about strategies for attracting and recruiting new workers in rural versus urban settings to identify key workforce challenges for rural and urban manufacturing firms and to uncover solutions they have implemented to address their immediate and long-term workforce needs. 

3D printing could catapult US manufacturing

Additive manufacturing, also known as 3D printing, has so far been used for simple construction. In this process, a computer creates three-dimensional objects by depositing materials, usually in layers. But now, the National Institute for Standards in Technology (NIST) is working to unlock additive manufacturing’s potential. For example, earlier this year, NIST researchers worked with polyelectrolyte complexes (PECs), resins with properties useful in fire protection, food packaging, drug delivery, insulation, and more. The scientists incorporated a technique that uses light to solidify a liquid resin, layer by layer, into a three-dimensional design.

Manufacturing conference set for Sept. 12-14

The inaugural Manufacturing Momentum Summit is an opportunity for federal, state, regional, and local leaders to share their efforts to prepare the workforce required for the advanced defense manufacturing supply chain. Held in conjunction with several partners, including the DoD Manufacturing Technology Program, the Center for Regional Economic Competitiveness, and the American Manufacturing Communities Collaborative, the Summit will be held from September 12 - 14, 2023, in Arlington, VA. Featured topics include a focus on AI’s impact on the manufacturing workforce, practical strategies for engaging employers, and an overview of the 2024 Defense budget. The program can be found here.

NSF expands its advanced materials network with nine new centers

The National Science Foundation (NSF) is expanding a network of research centers across the country to translate university-based R&D into new, and hopefully, better advanced materials. In late June, NSF announced the distribution of $162 million to support the creation of nine more Materials Research Science & Engineering Centers (MRSECs), bringing the total number of centers to twenty. Each of the new centers will receive $18 million over six years.

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