chips

NATCAST selects CA, NY for semiconductor R&D facilities

NATCAST, the operator of the National Semiconductor Technology Center (NSTC) tasked with bolstering the United States' semiconductor industry, announced Albany NY and Sunnyvale CA as the locations for two major R&D facilities. The funding comes from the CHIPS and Science Act of 2022, legislation aimed at revitalizing American semiconductor manufacturing and research.

CHIPS for America to invest up to $1.6 billion to accelerate U.S. capacity advanced packaging

The U.S. Department of Commerce recently issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities to accelerate domestic capacity for semiconductor advanced packaging.​ As part of CHIPS for America, the National Advanced Packaging Manufacturing Program plans to invest up to $1.6 billion to fund innovation in five R&D areas related to semiconductor advanced packaging. ​

Initiative for a Competitive Inner City (ICIC) recommends policies to increase racial equity in manufacturing supply chains

Three pieces of federal legislation enacted in 2021 and 2022—the Infrastructure Investment and Jobs Act (IIJA), CHIPS and Science Act (CHIPS Act), and Inflation Reduction Act (IRA)—collectively authorize nearly $1.5 trillion to reshape America’s industrial landscape. But will this money help the 107 Black-owned and 151 Hispanic-owned companies in the manufacturing supply chains that the legislation is designed to support? 

A bipartisan group of Senators releases recommendations for AI policy

On Wednesday, a bipartisan group of senators published Driving U.S. Innovation in Artificial Intelligence: A Roadmap for Artificial Intelligence Policy in the United States Senate. The roadmap encourages the executive branch and the Senate Appropriations Committee to reach the $32 billion per year non-defense AI innovation spending level proposed by the National Security Commission on Artificial Intelligence.

CHIPS for America announces $285 million funding opportunity for a Manufacturing USA Institute

The National Institute of Standards and Technology (NIST) has issued a Notice of Funding Opportunity (NOFO) seeking proposals to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. The CHIPS for America Program anticipates up to approximately $285 million in funding will be awarded to the institute.

Dept of Commerce announces CHIPS funds for TSMC and Samsung

The U.S. Department of Commerce has recently signed two non-binding preliminary memorandums of terms (PMTs) with semiconductor companies to provide direct funding under the CHIPS and Science Act. One company, the TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), will receive up to $6.6 billion to support the company’s investment of more than $65 billion in three greenfield fabs in Phoenix, Arizona.

CHIPS program suspends plans for R&D facilities program; other R&D programs unaffected

The Commerce Department has suspended plans to announce a funding opportunity for the construction, modernization, or expansion of commercial semiconductor R&D facilities, according to an announcement the CHIPS Program Office made in their newsletter last week. The suspension does not impact the $11 billion the CHIPS Program Office still plans to spend on semiconductor R&D through separate R&D programs, nor does it affect the awards for incentive program funding opportunities already announced.

The White House announces over $5B from CHIPS and Science Act for R&D and workforce programs, other updates on semiconductor programs, including Mfg USA Institute

The White House announced on February 9 that the administration expects to invest over $5 billion in semiconductor-related research, development, and workforce needs. The $5 billion will flow through the National Semiconductor Technology Center (NSTC), a public-private entity created to handle the funds. Friday’s announcement established the NSTC as a public-private consortium of the Secretaries of Commerce, Defense, and Energy, the Director of the National Science Foundation, and Natcast.

NIST reveals plan for boosting U.S. advanced packaging capabilities for semiconductors

Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio recently revealed in public comments that approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging.

NIST issues final rules to prevent improper use of CHIPS Act funding

The CHIPS and Science Act (Act) established guardrails to prevent funding recipients from using the money to support the development of semiconductor manufacturing and technology in foreign countries of concern, including North Korea, China, Russia, and Iran. On September 25, 2023, the CHIPS Program Office CPO published the final rules for preventing improper use of CHIPS Act funding.